UP-3000 Fastest 3D Confocal Profiler + White Light Interferometer

Capture The 3D Profile From Any Material

The UP-3000 integrates Spinning Disk Confocal, White Light Interferometry, Dark Field, Variable Focus, and Bright Field imaging in a single optical head. Furthermore, switching between modes requires no hardware changes — one click selects the appropriate technique for the sample at hand. As a result, there is no need to move samples between instruments when measurement conditions change. In modern material science, many researchers choose a 3D optical profilometer confocal instrument to achieve high-resolution and accurate profiles across diverse sample types.

Fastest Confocal – Spinning Disk

The confocal module uses a spinning Nipkow disk with thousands of rotating pinholes that physically block out-of-focus light from the detector. The entire sample area is furthermore illuminated simultaneously, enabling full-area scans without XY stage motion. This approach is therefore faster than point-scanning or laser confocal systems. Additionally, it provides the highest XY lateral resolution for transparent layers, steep slopes, dark surfaces, and rough coatings commonly analysed by 3D optical profilometer confocal solutions.

Interferometry for Sub-Nanometer Roughness

The white light interferometry mode uses broadband illumination to generate interference fringes that encode surface height with sub-nanometer vertical precision. Both phase-shift interferometry (for smooth surfaces) and scanning white light interferometry (for rough surfaces) are furthermore available. As a result, the high-speed camera acquires interferometric data rapidly, therefore making surface roughness measurement and step height analysis fast and repeatable.

Dark Field Imaging Modes

Dark field imaging mode is particularly effective for detecting surface cracks, delamination edges, particle contamination, and micro-scale defects that are difficult to see under bright field illumination. The dark background created by the dark field optics furthermore makes reflective features at crack edges and surface discontinuities appear bright against the dark surround. As a result, this provides high-contrast imaging for quality control screening of coated components, glass substrates, and semiconductor wafers. For comprehensive defect detection, a 3D optical profilometer confocal approach ensures reliable and reproducible imaging. Consequently, individual defects can therefore be located and characterized with ease.

Variable Focus, Bright Field Imaging

Variable focus mode acquires a stack of focal planes and consequently generates an entirely in-focus 3D image across large Z ranges. Furthermore, bright field covers conventional optical microscopy needs without switching instruments.

Automatic Stitching

What the UP-3000 Measures

The Rtec UP-3000 is a versatile 3D optical profilometer designed to perform high-precision, non-contact surface measurements across a wide variety of materials and applications. It accurately measures surface roughness, 3D topography, step height, film thickness, surface texture, waviness, volume, and defect geometry, providing comprehensive characterization for quality control, research, and manufacturing.

By combining five optical imaging technologies—Confocal Microscopy, White Light Interferometry, Bright Field, Dark Field, and Variable Focus Imaging—the UP-3000 automatically selects the optimal measurement mode for each sample. This enables reliable inspection of transparent materials, polished metals, rough surfaces, coatings, semiconductor wafers, optical components, and additively manufactured parts.

Its spinning disk confocal microscopy delivers exceptional XY resolution and fast area scanning, making it ideal for resolving fine surface features, steep slopes, microstructures, and complex geometries that are difficult to measure with conventional optical systems. White Light Interferometry provides sub-nanometer vertical resolution for ultra-flat surfaces, while Dark Field imaging enhances the visibility of cracks, scratches, particles, and other surface defects. Together, these technologies provide fast, accurate, and repeatable 3D surface measurements without physically contacting or damaging the sample.