Rtec-Instruments CMP polishing platen and carrier head

化学機械式研磨機

CMP Pro-6 Chemical Mechanical Polishing Excellence

お問い合わせ

Rtec-Instruments社のCMP Pro-6化学機械研磨装置は、研究、プロセス開発、および研磨用消耗品の評価を目的として設計された、高性能な卓上型CMPシステムです。 精密なダウンフォース制御、プログラム可能なプラテンおよびキャリア速度、自動スラリー供給、ならびにインシチュまたはエクシチュでのコンディショニングを組み合わせたCMP Pro-6により、エンジニアは卓越した再現性をもって研磨レシピを最適化することができます。 その堅牢なプラットフォームは、最大6インチのウェーハに対応し、最先端の半導体、MEMS、光学、および材料の研磨プロセスの開発を支援します。除去率、ウェーハ内均一性、パッドコンディショニング、あるいはスラリー性能の向上など、CMP Pro-6は、CMPの革新を加速し、製造歩留まりを向上させるために必要な柔軟性と制御性を提供します。

主な特長

Precise Process Control

Precisely control every polishing parameter with programmable platen speed, carrier speed, and adjustable downforce. The Rtec-Instruments CMP Pro-6 delivers exceptional repeatability for optimizing removal rate, surface finish, and within-wafer uniformity. Reproduce polishing conditions with confidence while accelerating process development and reducing experimental variability.

Fully Programmable Slurry Delivery

Integrated programmable slurry and DI water delivery ensure consistent fluid distribution throughout every polishing cycle. Evaluate new slurry chemistries, optimize polishing recipes, and improve process stability while reducing slurry consumption. Automated delivery enhances repeatability and minimizes operator influence for reliable CMP process development.

Versatile Wafer Handling

Support multiple wafer sizes using interchangeable carrier heads for 2", 4", and 6" substrates. The versatile platform enables polishing of semiconductor wafers, MEMS devices, optical materials, and advanced ceramics on a single system, providing maximum flexibility for research laboratories and process development.

Advanced Pad Conditioning

Integrated in-situ and ex-situ pad conditioning maintains consistent pad surface properties throughout polishing. Optimize conditioning parameters, extend pad lifetime, and improve polishing uniformity while evaluating pad performance under realistic operating conditions. Achieve stable, repeatable CMP results across every stage of process development.

Designed for CMP Research & Development

Purpose-built for CMP research, the Rtec-Instruments CMP Pro-6 provides the flexibility required to develop and optimize polishing processes, consumables, and materials. Investigate polishing pads, slurries, conditioners, and wafer materials while accelerating process innovation before transferring optimized recipes to production environments.

詳細はこちら

CMPの代表的な用途

半導体製造

  • シリコンウェハーの研磨
  • 酸化物（SiO₂）の平坦化
  • 銅CMP
  • 誘電体CMP
  • 高度なロジックおよびメモリデバイス

MEMS製造

  • 表面平坦化
  • 微細加工プロセスの開発
  • MEMSウェーハの仕上げ加工

CMPプロセス開発

  • 除去率の最適化
  • ウェハー内不均一性の調査
  • レシピ開発
  • プロセスの再現性評価

CMP消耗品の評価

  • 研磨パッドの性能
  • スラリーの開発
  • コンディショナーの最適化
  • 裏打ちフィルムの評価

材料研究

  • 先端セラミックス
  • ガラスの研磨
  • サファイア基板
  • 化合物半導体（SiC、GaN）
  • 光学材料

大学・研究機関

  • CMPプロセスの教育
  • 新しい研磨用化学薬品
  • 表面処理に関する研究
  • 材料特性評価
Platen Diameter380 mm
Platen Speed1-100 rpm
Wafer Sizeup to 6” Wafer
Max Downforce25kgf
Head rpm1 - 100 rpm
Conditioner4.25” diameter
Additional OptionsCarrier head for 6’’’,4’’’,2” wafers
Power220V, 30A
Size:870 x 800 x 870mm

よくある質問

Chemical Mechanical Polishing (CMP) is a wafer planarization process that combines mechanical abrasion with chemical reactions to remove material and create ultra-flat surfaces. CMP is essential in semiconductor, MEMS, photonics, and advanced materials manufacturing, where nanometer-scale surface planarity is required.
The Rtec-Instruments CMP Pro-6 is a benchtop CMP research system designed for process development, polishing optimization, slurry evaluation, pad conditioning, consumable testing, and materials research. It allows researchers to develop and optimize polishing processes before transferring them to production.
The CMP Pro-6 supports interchangeable carrier heads for polishing 2-inch, 4-inch, and 6-inch wafers. This flexibility makes it suitable for universities, research laboratories, pilot production, and semiconductor process development.
The system is suitable for polishing a wide range of materials, including silicon wafers, silicon dioxide (SiO₂), compound semiconductors, MEMS substrates, optical materials, ceramics, sapphire, and other advanced engineering materials used in research and manufacturing.
Yes. The programmable slurry delivery system enables researchers to compare different slurry chemistries, optimize slurry flow rates, improve removal rates, and evaluate polishing performance under highly repeatable laboratory conditions.
Yes. The instrument includes both in-situ and ex-situ pad conditioning capabilities, allowing users to maintain consistent pad performance, improve polishing repeatability, and investigate conditioning parameters during CMP process development.
Users can independently control platen speed, carrier speed, polishing downforce, slurry delivery, and pad conditioning. These programmable parameters provide excellent flexibility for optimizing removal rate, surface finish, and wafer uniformity.
Absolutely. Its compact benchtop design, versatile wafer handling, and programmable process control make the CMP Pro-6 ideal for universities, research institutes, semiconductor R&D laboratories, and materials science education.
The CMP Pro-6 supports research and development in semiconductor manufacturing, MEMS fabrication, photonics, optics, advanced ceramics, electronics, nanotechnology, and materials science, wherever precision surface planarization and polishing process optimization are required
The Rtec-Instruments CMP Pro-6 combines precise process control, programmable slurry delivery, advanced pad conditioning, and flexible wafer handling in a compact benchtop platform. It provides researchers with a cost-effective solution for accelerating CMP process development, evaluating consumables, and improving polishing performance before production-scale implementation.

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