Rtec-Instruments CMP polishing platen and carrier head

Polisseuse chimico-mécanique

CMP Pro-6 Chemical Mechanical Polishing Excellence

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La polisseuse chimico-mécanique CMP Pro-6 de Rtec-Instruments est un système CMP de paillasse hautement performant, conçu pour la recherche, le développement de procédés et l’évaluation des consommables de polissage. Alliant un contrôle précis de la force d’appui, des vitesses programmables du plateau et du support, une distribution automatique de la pâte de polissage et un conditionnement in situ ou ex situ, la CMP Pro-6 permet aux ingénieurs d’optimiser les recettes de polissage avec une répétabilité exceptionnelle. Sa plate-forme rigide peut accueillir des plaquettes allant jusqu’à 6 pouces tout en facilitant le développement de procédés avancés de polissage pour les semi-conducteurs, les MEMS, l’optique et les matériaux. Qu’il s’agisse d’améliorer le taux d’enlèvement, l’uniformité intra-plaquette, le conditionnement des tampons ou les performances de la pâte de polissage, le CMP Pro-6 offre la flexibilité et le contrôle nécessaires pour accélérer l’innovation en matière de CMP et améliorer le rendement de fabrication.

CARACTÉRISTIQUES PRINCIPALES

Precise Process Control

Precisely control every polishing parameter with programmable platen speed, carrier speed, and adjustable downforce. The Rtec-Instruments CMP Pro-6 delivers exceptional repeatability for optimizing removal rate, surface finish, and within-wafer uniformity. Reproduce polishing conditions with confidence while accelerating process development and reducing experimental variability.

Fully Programmable Slurry Delivery

Integrated programmable slurry and DI water delivery ensure consistent fluid distribution throughout every polishing cycle. Evaluate new slurry chemistries, optimize polishing recipes, and improve process stability while reducing slurry consumption. Automated delivery enhances repeatability and minimizes operator influence for reliable CMP process development.

Versatile Wafer Handling

Support multiple wafer sizes using interchangeable carrier heads for 2", 4", and 6" substrates. The versatile platform enables polishing of semiconductor wafers, MEMS devices, optical materials, and advanced ceramics on a single system, providing maximum flexibility for research laboratories and process development.

Advanced Pad Conditioning

Integrated in-situ and ex-situ pad conditioning maintains consistent pad surface properties throughout polishing. Optimize conditioning parameters, extend pad lifetime, and improve polishing uniformity while evaluating pad performance under realistic operating conditions. Achieve stable, repeatable CMP results across every stage of process development.

Designed for CMP Research & Development

Purpose-built for CMP research, the Rtec-Instruments CMP Pro-6 provides the flexibility required to develop and optimize polishing processes, consumables, and materials. Investigate polishing pads, slurries, conditioners, and wafer materials while accelerating process innovation before transferring optimized recipes to production environments.

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Applications typiques du CMP

Fabrication de semi-conducteurs

  • Polissage des plaquettes de silicium
  • Planarisation de l’oxyde (SiO₂)
  • CMP au cuivre
  • CMP diélectrique
  • Dispositifs logiques et de mémoire avancés

Fabrication de MEMS

  • Planarisation de surface
  • Développement de procédés de microfabrication
  • Finition des plaquettes MEMS

Développement des procédés CMP

  • Optimisation du taux d’élimination
  • Études sur les non-uniformités intra-plaquette
  • Élaboration de recettes
  • Évaluation de la répétabilité du procédé

Évaluation des consommables CMP

  • Performances des tampons de polissage
  • Mise au point des boues
  • Optimisation des conditionneurs
  • Évaluation du film de support

Recherche sur les matériaux

  • Céramiques de pointe
  • Polissage du verre
  • Substrats en saphir
  • Semi-conducteurs composés (SiC, GaN)
  • Matériaux optiques

Universités et laboratoires de recherche

  • Formation au processus CMP
  • Nouvelles formules chimiques de polissage
  • Recherche sur les traitements de surface
  • Caractérisation des matériaux
Platen Diameter380 mm
Platen Speed1-100 rpm
Wafer Sizeup to 6” Wafer
Max Downforce25kgf
Head rpm1 - 100 rpm
Conditioner4.25” diameter
Additional OptionsCarrier head for 6’’’,4’’’,2” wafers
Power220V, 30A
Size:870 x 800 x 870mm

Foire aux questions

Chemical Mechanical Polishing (CMP) is a wafer planarization process that combines mechanical abrasion with chemical reactions to remove material and create ultra-flat surfaces. CMP is essential in semiconductor, MEMS, photonics, and advanced materials manufacturing, where nanometer-scale surface planarity is required.
The Rtec-Instruments CMP Pro-6 is a benchtop CMP research system designed for process development, polishing optimization, slurry evaluation, pad conditioning, consumable testing, and materials research. It allows researchers to develop and optimize polishing processes before transferring them to production.
The CMP Pro-6 supports interchangeable carrier heads for polishing 2-inch, 4-inch, and 6-inch wafers. This flexibility makes it suitable for universities, research laboratories, pilot production, and semiconductor process development.
The system is suitable for polishing a wide range of materials, including silicon wafers, silicon dioxide (SiO₂), compound semiconductors, MEMS substrates, optical materials, ceramics, sapphire, and other advanced engineering materials used in research and manufacturing.
Yes. The programmable slurry delivery system enables researchers to compare different slurry chemistries, optimize slurry flow rates, improve removal rates, and evaluate polishing performance under highly repeatable laboratory conditions.
Yes. The instrument includes both in-situ and ex-situ pad conditioning capabilities, allowing users to maintain consistent pad performance, improve polishing repeatability, and investigate conditioning parameters during CMP process development.
Users can independently control platen speed, carrier speed, polishing downforce, slurry delivery, and pad conditioning. These programmable parameters provide excellent flexibility for optimizing removal rate, surface finish, and wafer uniformity.
Absolutely. Its compact benchtop design, versatile wafer handling, and programmable process control make the CMP Pro-6 ideal for universities, research institutes, semiconductor R&D laboratories, and materials science education.
The CMP Pro-6 supports research and development in semiconductor manufacturing, MEMS fabrication, photonics, optics, advanced ceramics, electronics, nanotechnology, and materials science, wherever precision surface planarization and polishing process optimization are required
The Rtec-Instruments CMP Pro-6 combines precise process control, programmable slurry delivery, advanced pad conditioning, and flexible wafer handling in a compact benchtop platform. It provides researchers with a cost-effective solution for accelerating CMP process development, evaluating consumables, and improving polishing performance before production-scale implementation.

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