Rtec-Instruments CMP polishing platen and carrier head

Chemisch-mechanische Poliermaschine

CMP Pro-6 Chemical Mechanical Polishing Excellence

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Die chemisch-mechanische Poliermaschine CMP Pro-6 von Rtec-Instruments ist ein leistungsstarkes Tisch-CMP-System, das für Forschung, Prozessentwicklung und die Bewertung von Polierverbrauchsmaterialien konzipiert wurde. Durch die Kombination aus präziser Anpresskraftsteuerung, programmierbaren Platten- und Trägergeschwindigkeiten, automatischer Slurry-Zufuhr sowie In-situ- oder Ex-situ-Konditionierung ermöglicht das CMP Pro-6 Ingenieuren die Optimierung von Polierrezepturen mit außergewöhnlicher Wiederholgenauigkeit. Seine stabile Plattform bietet Platz für Wafer mit einem Durchmesser von bis zu 6 Zoll und unterstützt gleichzeitig die Entwicklung fortschrittlicher Polierprozesse für Halbleiter, MEMS, Optik und Werkstoffe. Ob es um die Verbesserung der Abtragsrate, der Gleichmäßigkeit innerhalb des Wafers, der Pad-Konditionierung oder der Slurry-Leistung geht – der CMP Pro-6 bietet die erforderliche Flexibilität und Kontrolle, um Innovationen im Bereich CMP voranzutreiben und die Fertigungsausbeute zu steigern.

HAUPTMERKMALE

Precise Process Control

Precisely control every polishing parameter with programmable platen speed, carrier speed, and adjustable downforce. The Rtec-Instruments CMP Pro-6 delivers exceptional repeatability for optimizing removal rate, surface finish, and within-wafer uniformity. Reproduce polishing conditions with confidence while accelerating process development and reducing experimental variability.

Fully Programmable Slurry Delivery

Integrated programmable slurry and DI water delivery ensure consistent fluid distribution throughout every polishing cycle. Evaluate new slurry chemistries, optimize polishing recipes, and improve process stability while reducing slurry consumption. Automated delivery enhances repeatability and minimizes operator influence for reliable CMP process development.

Versatile Wafer Handling

Support multiple wafer sizes using interchangeable carrier heads for 2", 4", and 6" substrates. The versatile platform enables polishing of semiconductor wafers, MEMS devices, optical materials, and advanced ceramics on a single system, providing maximum flexibility for research laboratories and process development.

Advanced Pad Conditioning

Integrated in-situ and ex-situ pad conditioning maintains consistent pad surface properties throughout polishing. Optimize conditioning parameters, extend pad lifetime, and improve polishing uniformity while evaluating pad performance under realistic operating conditions. Achieve stable, repeatable CMP results across every stage of process development.

Designed for CMP Research & Development

Purpose-built for CMP research, the Rtec-Instruments CMP Pro-6 provides the flexibility required to develop and optimize polishing processes, consumables, and materials. Investigate polishing pads, slurries, conditioners, and wafer materials while accelerating process innovation before transferring optimized recipes to production environments.

Mehr dazu

Typische CMP-Anwendungen

Halbleiterfertigung

  • Polieren von Siliziumwafern
  • Planarisierung von Oxid (SiO₂)
  • Kupfer-CMP
  • Dielektrisches CMP
  • Fortgeschrittene Logik- und Speicherbausteine

MEMS-Fertigung

  • Oberflächenplanarisierung
  • Entwicklung von Mikrofabrikationsverfahren
  • Endbearbeitung von MEMS-Wafern

CMP-Prozessentwicklung

  • Optimierung der Entsorgungsrate
  • Untersuchungen zur In-Wafer-Inhomogenität
  • Rezeptentwicklung
  • Bewertung der Prozesswiederholbarkeit

Bewertung von CMP-Verbrauchsmaterialien

  • Leistung des Polierpads
  • Entwicklung von Schlammgemischen
  • Optimierung der Konditionierung
  • Bewertung der Trägerfolie

Materialforschung

  • Hochleistungskeramik
  • Glaspolieren
  • Saphirsubstrate
  • Verbundhalbleiter (SiC, GaN)
  • Optische Materialien

Universitäts- und Forschungslabore

  • Schulung zum CMP-Verfahren
  • Neue Polierchemikalien
  • Forschung im Bereich der Oberflächenveredelung
  • Materialcharakterisierung
Platen Diameter380 mm
Platen Speed1-100 rpm
Wafer Sizeup to 6” Wafer
Max Downforce25kgf
Head rpm1 - 100 rpm
Conditioner4.25” diameter
Additional OptionsCarrier head for 6’’’,4’’’,2” wafers
Power220V, 30A
Size:870 x 800 x 870mm

Häufig gestellte Fragen

Chemical Mechanical Polishing (CMP) is a wafer planarization process that combines mechanical abrasion with chemical reactions to remove material and create ultra-flat surfaces. CMP is essential in semiconductor, MEMS, photonics, and advanced materials manufacturing, where nanometer-scale surface planarity is required.
The Rtec-Instruments CMP Pro-6 is a benchtop CMP research system designed for process development, polishing optimization, slurry evaluation, pad conditioning, consumable testing, and materials research. It allows researchers to develop and optimize polishing processes before transferring them to production.
The CMP Pro-6 supports interchangeable carrier heads for polishing 2-inch, 4-inch, and 6-inch wafers. This flexibility makes it suitable for universities, research laboratories, pilot production, and semiconductor process development.
The system is suitable for polishing a wide range of materials, including silicon wafers, silicon dioxide (SiO₂), compound semiconductors, MEMS substrates, optical materials, ceramics, sapphire, and other advanced engineering materials used in research and manufacturing.
Yes. The programmable slurry delivery system enables researchers to compare different slurry chemistries, optimize slurry flow rates, improve removal rates, and evaluate polishing performance under highly repeatable laboratory conditions.
Yes. The instrument includes both in-situ and ex-situ pad conditioning capabilities, allowing users to maintain consistent pad performance, improve polishing repeatability, and investigate conditioning parameters during CMP process development.
Users can independently control platen speed, carrier speed, polishing downforce, slurry delivery, and pad conditioning. These programmable parameters provide excellent flexibility for optimizing removal rate, surface finish, and wafer uniformity.
Absolutely. Its compact benchtop design, versatile wafer handling, and programmable process control make the CMP Pro-6 ideal for universities, research institutes, semiconductor R&D laboratories, and materials science education.
The CMP Pro-6 supports research and development in semiconductor manufacturing, MEMS fabrication, photonics, optics, advanced ceramics, electronics, nanotechnology, and materials science, wherever precision surface planarization and polishing process optimization are required
The Rtec-Instruments CMP Pro-6 combines precise process control, programmable slurry delivery, advanced pad conditioning, and flexible wafer handling in a compact benchtop platform. It provides researchers with a cost-effective solution for accelerating CMP process development, evaluating consumables, and improving polishing performance before production-scale implementation.

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