Rtec-Instruments CMP polishing platen and carrier head

Pulidora químico-mecánica

CMP Pro-6 Chemical Mechanical Polishing Excellence

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La pulidora químico-mecánica CMP Pro-6 de Rtec-Instruments es un sistema CMP de sobremesa de alto rendimiento diseñado para la investigación, el desarrollo de procesos y la evaluación de consumibles de pulido. Gracias a su preciso control de la fuerza de presión, las velocidades programables de la placa y el portador, el suministro automático de pasta de pulido y el acondicionamiento in situ o ex situ, la CMP Pro-6 te permite optimizar las recetas de pulido con una repetibilidad excepcional. Su plataforma rígida admite obleas de hasta 6 pulgadas y facilita el desarrollo de procesos avanzados de pulido para semiconductores, MEMS, óptica y materiales. Ya sea para mejorar la tasa de eliminación, la uniformidad dentro de la oblea, el acondicionamiento de la almohadilla o el rendimiento de la pasta de pulido, el CMP Pro-6 ofrece la flexibilidad y el control necesarios para acelerar la innovación en CMP y mejorar el rendimiento de la fabricación.

CARACTERÍSTICAS PRINCIPALES

Precise Process Control

Precisely control every polishing parameter with programmable platen speed, carrier speed, and adjustable downforce. The Rtec-Instruments CMP Pro-6 delivers exceptional repeatability for optimizing removal rate, surface finish, and within-wafer uniformity. Reproduce polishing conditions with confidence while accelerating process development and reducing experimental variability.

Fully Programmable Slurry Delivery

Integrated programmable slurry and DI water delivery ensure consistent fluid distribution throughout every polishing cycle. Evaluate new slurry chemistries, optimize polishing recipes, and improve process stability while reducing slurry consumption. Automated delivery enhances repeatability and minimizes operator influence for reliable CMP process development.

Versatile Wafer Handling

Support multiple wafer sizes using interchangeable carrier heads for 2", 4", and 6" substrates. The versatile platform enables polishing of semiconductor wafers, MEMS devices, optical materials, and advanced ceramics on a single system, providing maximum flexibility for research laboratories and process development.

Advanced Pad Conditioning

Integrated in-situ and ex-situ pad conditioning maintains consistent pad surface properties throughout polishing. Optimize conditioning parameters, extend pad lifetime, and improve polishing uniformity while evaluating pad performance under realistic operating conditions. Achieve stable, repeatable CMP results across every stage of process development.

Designed for CMP Research & Development

Purpose-built for CMP research, the Rtec-Instruments CMP Pro-6 provides the flexibility required to develop and optimize polishing processes, consumables, and materials. Investigate polishing pads, slurries, conditioners, and wafer materials while accelerating process innovation before transferring optimized recipes to production environments.

Más información sobre

Aplicaciones típicas del CMP

Fabricación de semiconductores

  • Pulido de obleas de silicio
  • Planarización del óxido (SiO₂)
  • CMP de cobre
  • CMP dieléctrico
  • Dispositivos avanzados de lógica y memoria

Fabricación de MEMS

  • Planarización de superficies
  • Desarrollo de procesos de microfabricación
  • Acabado de obleas MEMS

Desarrollo de procesos de CMP

  • Optimización de la tasa de eliminación
  • Estudios sobre la falta de uniformidad dentro de una oblea
  • Desarrollo de recetas
  • Evaluación de la repetibilidad del proceso

Evaluación de consumibles CMP

  • Rendimiento de las almohadillas de pulido
  • Desarrollo de lechadas
  • Optimización del acondicionador
  • Evaluación de la película de soporte

Investigación sobre materiales

  • Cerámica avanzada
  • Pulido de cristal
  • Sustratos de zafiro
  • Semiconductores compuestos (SiC, GaN)
  • Materiales ópticos

Universidad y laboratorios de investigación

  • Formación sobre el proceso CMP
  • Nuevos productos químicos para el pulido
  • Investigación sobre acabados superficiales
  • Caracterización de materiales
Platen Diameter380 mm
Platen Speed1-100 rpm
Wafer Sizeup to 6” Wafer
Max Downforce25kgf
Head rpm1 - 100 rpm
Conditioner4.25” diameter
Additional OptionsCarrier head for 6’’’,4’’’,2” wafers
Power220V, 30A
Size:870 x 800 x 870mm

Preguntas frecuentes

Chemical Mechanical Polishing (CMP) is a wafer planarization process that combines mechanical abrasion with chemical reactions to remove material and create ultra-flat surfaces. CMP is essential in semiconductor, MEMS, photonics, and advanced materials manufacturing, where nanometer-scale surface planarity is required.
The Rtec-Instruments CMP Pro-6 is a benchtop CMP research system designed for process development, polishing optimization, slurry evaluation, pad conditioning, consumable testing, and materials research. It allows researchers to develop and optimize polishing processes before transferring them to production.
The CMP Pro-6 supports interchangeable carrier heads for polishing 2-inch, 4-inch, and 6-inch wafers. This flexibility makes it suitable for universities, research laboratories, pilot production, and semiconductor process development.
The system is suitable for polishing a wide range of materials, including silicon wafers, silicon dioxide (SiO₂), compound semiconductors, MEMS substrates, optical materials, ceramics, sapphire, and other advanced engineering materials used in research and manufacturing.
Yes. The programmable slurry delivery system enables researchers to compare different slurry chemistries, optimize slurry flow rates, improve removal rates, and evaluate polishing performance under highly repeatable laboratory conditions.
Yes. The instrument includes both in-situ and ex-situ pad conditioning capabilities, allowing users to maintain consistent pad performance, improve polishing repeatability, and investigate conditioning parameters during CMP process development.
Users can independently control platen speed, carrier speed, polishing downforce, slurry delivery, and pad conditioning. These programmable parameters provide excellent flexibility for optimizing removal rate, surface finish, and wafer uniformity.
Absolutely. Its compact benchtop design, versatile wafer handling, and programmable process control make the CMP Pro-6 ideal for universities, research institutes, semiconductor R&D laboratories, and materials science education.
The CMP Pro-6 supports research and development in semiconductor manufacturing, MEMS fabrication, photonics, optics, advanced ceramics, electronics, nanotechnology, and materials science, wherever precision surface planarization and polishing process optimization are required
The Rtec-Instruments CMP Pro-6 combines precise process control, programmable slurry delivery, advanced pad conditioning, and flexible wafer handling in a compact benchtop platform. It provides researchers with a cost-effective solution for accelerating CMP process development, evaluating consumables, and improving polishing performance before production-scale implementation.

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