The state of the art Rtec CMP tester CP-6 allows to study and characterize CMP process like never before. In addition to polishing wafers & substrates the tester comes with inline surface profilometer. This combinations sheds information on why and how the surface, friction, wear etc. changed. Tester also measures several inline parameters such as friction, surface roughness, wear volume etc. to understand the process in detail.
● Integrated Confocal 3D Microscope to characterize any material pad surface with nm resolution
● Inline Friction, Acoustic emission to study process
● Inline temperature sensors
● Several wafer sizes can be mounted
● Controllable Down force and Speeds
XY + 2x Rotary Motion + 2X Z motions- Standard configuration has X,Y, stage to move the platen between polishing and imaging positions. In addition XY stage helps to oscillate wafer during polishing. Using Platen with XY drive allows an unique multi axis drive combination allows to create any custom motion to simulate testing conditions close to real life scenario.
Torque - High resolution inline torque sensors allows for end pointing, and characterizing surfaces in real time
Acoustic - Sound signal signal that allows to qualitatively end point or help to detect debris, defects during polishing process.
Rtec Chemical mechanical polisher tester comes with inline integrated 3d profilometer that is optimized to characterize pad surface with nm resolution. The profiler comes with confocal mode + interferometer mode + dark field and bright field modes. This allows to study surface change vs time with nm resolution. Why friction force changes can be easily quantified. The tester allows for automatic stitching across a large surface area for volume wear, roughness calculations.