CP-5000 Chemical Mechanical Polisher Overview
- Real Time Coefficient of Friction
- Controlled Down Force and Speed
- Integrated 3D profilometer
- Several wafer sizes can be mounted
- In-line Temperature and Acoustic Emission to study process
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CMP Tester Features
Unmatched Load Cell Technology and Speed
During the polishing process, high resolution in-line force measurements quantify interfacial interactions. To optimize the process, the CP-6 provides full control of down force. This includes speed and flow rates based on customized test protocols.
Self-leveling upper pad conditioner holder with both active rotation and horizontal oscillations.
Accommodates conditioner from 0.5 “to 4.25”
Reliable and Accurate
Each CMP Tester is versatile with many sensors and temperature options. The motorized XY stage comes with fast exchange, providing meaningful data with ease.
Ease Of Use
The CP-5000 comes with Fast Exchange carriers. As a result, quick and easy mounting of wafer and pads is achieved. The software comes with predefined standard test recipes. The user keeps the ability to easily create new custom recipes.
Patented Integrated In-line 3D Profilometer
Characterize pad surface with nm resolution. The profiler comes with confocal, interferometer, dark field, and bright field modes. The chemical mechanical polisher provides automatic stitching across large surface areas. Essential for volume wear and roughness calculations.
Pad 1 Surface
Pad 2 Complete Bump Feature
3D Surface Change vs Test Runs
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